Samsung Electronics takes the semiconductor industry a step further by announcing a new technology called X-Cube (or sXtended-Cube). This new process will make it possible to create 3D chips, vertically, by stacking them on top of each other in different layers, so as to take up less space on the logic board, and also significantly reduce development costs.
Samsung X-Cube can use an EUV (extreme ultraviolet) production process at both 7 and 5 nm, ready for mass production this second part of the year, while TSV (through-silicon via) technology takes care of connecting the various stacks electrically, without having to use filaments or other materials. The signal is then transmitted more quickly through the various layers of the chip, this means that data is also transferred faster, also to the advantage of greater energy efficiency.
Chips and memories can therefore coexist on the same chip, stacked on top of each other, saving significant amounts of space. X-Cube also allows for greater freedom when designing each individual chip, so you can create customized solutions that best fit the needs of each OEM.
Samsung's intent is therefore clear: to regain its position as leader in the semiconductor market after overtaking Intel in 2019. Thanks to this technology, and the opening of a new production plant in South Korea, the goal is clearly to accelerate the pace, thanks to new cutting-edge technologies.
More details on the Samsung X-Cube will be shown at the next conference Hot Chips, which will be streamed from 16 to 18 August.