Huawei engineers employed in the development of new SoCs and mobile processors are said to be abandoning the company due to the sanctions imposed by the United States last May that prohibit access to foundries.
The report by DigiTimes shows a rather desolate situation, but in fact inevitable: HiSilicon, the company that develops the Kirin chips that are on board the vast majority of Huawei smartphones, is in fact unable to produce what it designs. All the most advanced foundries, such as that of TSMC and Samsung, are based on American technologies.
The Chinese government, in reaction to the sanctions imposed by the US, has launched a program of lavish financing for companies interested in advancing the production capacity of the national chip, but it will probably take a long time before being able to reach the competitive levels of the best in the field : to say, the most advanced production process achieved by a Chinese foundry is the 16 nm one (Kirin 710A, for example), while TSMC and Samsung are already mass producing the first 5 nm chips – and meanwhile they are working on the next steps.
HiSilicon, for its part, is trying to enter the sector in first person: it wants to carry out its first production process, at 45 nm, naturally without using American technology.